Explore Intel® Xeon® processor E5-2600 v4 product family software solutions for telco, cloud, HPC, security, big data/analytics and more.
With strong performance gains and new capabilities, explore what leading software vendors across various industries are already doing with servers based on the Intel® Xeon® processor E5-2600 v4 product family.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Discusses surface mount assembly processes, preconditioning flows and moisture absorption, thermal stress, and typical chemical environments. Also covers standardized moisture sensitivity levels and handling, packing, and shipping requirements.
Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.
Packaging Databook, Ch. 9: SMT Board Assembly Process Recs
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.
Chapter 12 Tape Carrier Package: A profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.
The Intel® Workstation Board S5000XVN provides incredible performance and memory capacity for demanding workstation operations. This workstation board is ideal for customers needing server-class performance, reliability, and high-end graphics.
Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.
Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.