Application Note: Interrupt swizzling solution for Intel® 5000 series chipset-based platforms.
Details the interrupt swizzling scheme and the programming and implementation requirements for the Intel® 5000 series chipset.
Spec Update: Device and documentation errata, specification clarifications and changes for the Intel® Xeon® processor 5400 series.
Document outlines thermal and mechanical operating limits and specifications as well as reference thermal solutions for the Intel® X79 Express Chipset Platform Controller Hub.
White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.
Discusses strategy to scale effective computing capabilities while containing power and cooling costs with Intel® Xeon® and Intel® Itanium® processor-based servers, delivering massive performance increases, cost savings and energy efficiency.
Design Guide: Hybrid PCB stack-up helps improve signal integrity performance for high-speed signaling at lower cost than an all low loss stack-up.
Design Guide: Describes how a hybrid PCB stack-up helps improve signal integrity performance for high-speed signaling at lower cost than an all low loss stack-up.
Salesforce shares how they get their data moving with HP 3PAR StoreServ* storage—based on Intel® technology—to prevent performance bottlenecks.
Salesforce shares how they get their data moving with HP 3PAR StoreServ* storage—based on Intel® Solid-State Drives, Intel® processors, and Gigabit Ethernet—to prevent bottlenecks from performance-damaging high latency and slow I/O.Full View >